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Roman pots/OMD cooling + stave integration
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Description
https://bnl.zoomgov.com/j/1658386942?pwd=jfdBW1OFxwIy2RZtW5c7jcQLg87afY.1
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Meeting topics:
*Discussion on integration of cooling with RP/OMD stave
Questions from Don & Jack on cooling:
- How are the cooling pins attached to the back of the ASIC and then attached to the cooling plate?
- Square pins in simulation, but round pins in reality.
- Need to stay coplanar?
- Yes, might need a heavier plane within the board?
- From Jack - copper-plated vias?
- Don: could trap gas.
- General questions from both sides:
- Need to know physical constraints (size of board, etc.) to adapt the cooling concept to the modern design.
- Vias, etc. not an issue --> as long as we have thermal connections between the back of the ASIC and the cooling plate.
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