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ePIC BIC: EOSB & SiPM's

US/Eastern
Description

 

Homework: 

  • Dimensions

    • Optical cookie dimensions (1.8mm, GlueX/ECAL)? - Maria followed up with Zisis.

    • SiPM sizes (1.3 cm x 1.3 cm) - Maria followed up with Zisis.

    • Define tolerance around SiPMS and light guides (“reserved space”) (AstroPix card) -> Maria Followed up with Sylvester

    • Design goal and maximum requirement on the space for AstroPix boards -> Maria followed up with Sylvester. 

  • Heat

    • heat consumption SiPM + peripherals

      • Follow-up with Norbert? (Maria) -> done, 2.5 W

    • Does power regulator etc get “hot”? -> WE DO NOT HAVE ANSWER TO IT

    • Add scale factor for Module PCB -> Module PCB generates some heat (< 20% more heat than AstroPix)

    • Need safety factor for all calculations (extra 20%, or 50% when we’re really uncertain)

    • Follow-up with Zisis on temperature stability -> Maria Followed up with Zisis

    • Need a sanity check on the cooling (follow-up with Dan?)

    • 09:00 09:20
      Update on EoSB Mechanics and Interfaces 20m
      Speakers: Kevin Bailey (member@anl.gov), Sylvester Joosten (Argonne National Laboratory)
    • 09:20 09:40
      Update on total estimated heat 20m
      Speakers: Maria Zurek (Argonne National Laboratory), Thomas O'Connor (member@anl.gov)
    • 09:40 10:00
      Roadmap for SiPM tests 20m
      Speakers: Henry Klest (Argonne National Laboratory), Maria Zurek (Argonne National Laboratory)