HEP-IC

Material Package

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Specific sessions

Specific contributions

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Sessions*

Organizational session

Overview of group activities

Poster session

Collaborating across institutions

New development efforts, trends and plans

Collaborations and partnerships with other research agencies and industry

New collaborations and training initiatives

HEP IP database

Include materials from selected sessions

Contributions*

A Review of the CHIPS for America Research and Development Programs (in session "Collaborations and partnerships with other research agencies and industry")

Advantages for HEP from synergies with industry (in session "Collaborations and partnerships with other research agencies and industry")

Argonne National Laboratory (in session "Overview of group activities")

Brookhaven National Laboratory (in session "Overview of group activities")

Circuits and devices for edge AI (in session "New development efforts, trends and plans")

Columbia University (in session "Overview of group activities")

Common methodologies, cloud-based tools, technologies, modeling (in session "Collaborations and partnerships with other research agencies and industry")

Cross-institutional training and continuous education in ASIC design (in session "New collaborations and training initiatives")

Cryogenic Device Modeling (in session "New development efforts, trends and plans")

Cryogenic Front-end ASICs for Low-Noise Charge and Light Readout (in session "New development efforts, trends and plans")

Fermilab (in session "Overview of group activities")

Front-ends for extreme conditions (in session "New development efforts, trends and plans")

Integrated silicon photonics (in session "New development efforts, trends and plans")

Introduction to the EIC (in session "Organizational session")

Lawrence Berkeley National Laboratory (in session "Overview of group activities")

Massachusetts Institute of Technology (in session "Overview of group activities")

Monolithic stitched pixel sensor (in session "New development efforts, trends and plans")

Open discussion (in session "Collaborating across institutions")

Open discussion (cancelled) (in session "New development efforts, trends and plans")

Open-source ASIC ecosystem (in session "New development efforts, trends and plans")

Open-source silicon enabling HEP-IC opportunities (in session "Collaborations and partnerships with other research agencies and industry")

Other training opportunities (in session "New collaborations and training initiatives")

Precision timing in HEP experiments (in session "New development efforts, trends and plans")

Purpose of the meeting (in session "Organizational session")

Recent experience of inter-institutional projects (in session "Collaborations and partnerships with other research agencies and industry")

Report on the HEPIC internship program (in session "New collaborations and training initiatives")

Signal processing and filtering: analog, digital and beyond (AI?) (in session "New development efforts, trends and plans")

SLAC National Laboratory (in session "Overview of group activities")

Southern Methodist University (in session "Overview of group activities")

Superconducting (in session "New development efforts, trends and plans")

Synergy with DRD and RDC mechanisms (in session "Collaborations and partnerships with other research agencies and industry")

Talk from DOE (in session "Collaborations and partnerships with other research agencies and industry")

The CERN experience (in session "Collaborating across institutions")

Training initiatives by commercial tool vendors (in session "New collaborations and training initiatives")

Trends in pixel readout chip designs for high rate and radiation (in session "New development efforts, trends and plans")

Unconventional computing approaches using time, stochasticity, and physics (in session "New development efforts, trends and plans")

University of Hawaii (in session "Overview of group activities")

University of Pennsylvania (in session "Overview of group activities")

UT Arlington (in session "Overview of group activities")

Verification IP development (in session "New development efforts, trends and plans")

Verification with Cocotb (in session "New development efforts, trends and plans")

Welcome (in session "Organizational session")

Wide band-gap semiconductors (in session "New development efforts, trends and plans")

Working with National Labs and technology transfer (in session "Collaborations and partnerships with other research agencies and industry")

Include materials from selected contributions

Events scheduled on*

30/04/2024

01/05/2024

02/05/2024

Include materials from sessions/contributions scheduled on the selected dates