ePIC BIC: AstroPix Module Design

Monday 15 Jul 2024, 17:00 → 18:00 US/Eastern

• Topics:

  • Iterate on 9-chip PCB specs and design (see info below)

  • Review the development timeline

• Objective: Finalize the 9-chip PCB design and testing goals and schedule

• Zoom link: https://argonne.zoomgov.com/j/1614084427?pwd=NVZpZmhzeFpHOXNidlhNZ2tyVHJLQT09
  
  
  Info from Manoj 
  
  The document contains the basic idea behind the fabrication of the test PCB board to test the module concept and help build the assembly procedure. The document also contains minutes of last week's PCB Test Module discussion meeting and the AstroPix Module discussion during the in-person workshop. It also shows power consumption numbers and I/Os for the BIC-ePIC AstroPix Module. 
   
  A few important links (which are also present in the document) are, 
  All files and documents related to PCB test module board - link 
  Schematic and Gerber files for PCB board - Link 
  A-Step FPGA interfacing board - link 
  SW-FW package documentation for A-Step - link
  ComPair2 FEE documentation - link
  BIC-ePIC Interfacing document - link
   
  Also, here is a brief timeline - 
  • Layout and schematic for review in the second week of August
  • Send out for fabrication by the end of Aug
  • Considering 2-3 weeks of turnaround time
  • End of September, get them fabricated board
  • Build an aluminum carrier base for assembly procedure investigation at the end of September.
  • Dicing dummy chips (w/o wire-bond pads) - end of September 
  • November 15th - Assemble a few PCB Test Modules
  • Testing should start around mid-November 2024

17:00 → 17:25 Test Module PCB - Specs and Goals Overview¶

Speaker: Manoj Bhanudas Jadhav (Argonne National Laboratory)

17:25 → 17:50 Discussion¶

17:50 → 18:00 Timeline Discussion¶

Speaker: Manoj Bhanudas Jadhav (Argonne National Laboratory)