What is the length of each chapter?
8.3.4.1 The time-of-flight layers
Requirements
Requirements from physics: Add text here. (Xu, Yano)
Requirements from Radiation Hardness: Add text here. (Simone)
Requirements from Data Rates: Add text here. (Tonko)
Justification
Device concept and technological choice:
Subsystem description:
General device description: Add text here. (Zhenyu?)
Sensors: Add text here. (Simone, Satoshi)
FEE (FEE+modules): Add text here. (Wei, Tonko, Simone, Prithwish)
Other components: (PS, cooling) Add text here. (Frank, Oskar)
Performance (Kentaro, Prithwish, Tommy)
Implementation
Services: Add text here. (Frank, Wei, Zhangbu)
Subsystem mechanics and integration: Add text here. (Andy, Yang)
Calibration, alignment and monitoring: Add text here.(Satoshi, Zhangbu)
Status and remaining design effort:
R&D effort: Add text here. (Alex, Simone, Wei, Tonko)
E&D status and outlook: Add text here. (Andy, Simone, Yi, Satoshi)
Other activity needed for the design completion: Add text here. (Satoshi, Zhangbu)
Status of maturity of the subsystem: Add text here. (Satoshi, Zhangbu)
Environmental, Safety and Health (ES&H) aspects
and Quality Assessment (QA planning: Add text here. (Simone, Wei, Mathieu)
Construction and assembly planning: Add text here. (Simone, Satoshi, Wei, Tonko)
Collaborators and their role, resources and workforce: Add text here. (Satoshi, Zhangbu)
Risks and mitigation strategy: Add text here. (Satoshi, Zhangbu)
Additional Material Add text here.