https://www.overleaf.com/project/66e0603e1fc718e728c9d072
will add those who would like to edit in the group.
If your name is missing from the list, please let me and Satoshi know.
8.3.4.1 The time-of-flight layers
Requirements
Requirements from physics: Add text here. (Xu, Yano)
Requirements from Radiation Hardness: Add text here. (Simone)
Requirements from Data Rates: Add text here. (Tonko)
Justification
Device concept and technological choice:
Subsystem description:
General device description: Add text here. (Zhenyu?)
Sensors: Add text here. (Simone, Satoshi)
FEE (FEE+modules): Add text here. (Wei, Tonko, Simone, Prithwish)
Other components: (PS, cooling) Add text here. (Frank, Oskar)
Performance (Kentaro, Prithwish, Tommy)
Implementation
Services: Add text here. (Frank, Wei, Zhangbu)
Subsystem mechanics and integration: Add text here. (Andy, Yang)
Calibration, alignment and monitoring: Add text here.(Satoshi, Zhangbu)
Status and remaining design effort:
R&D effort: Add text here. (Alex, Simone, Wei, Tonko)
E&D status and outlook: Add text here. (Andy, Simone, Yi, Satoshi)
Other activity needed for the design completion: Add text here. (Satoshi, Zhangbu)
Status of maturity of the subsystem: Add text here. (Satoshi, Zhangbu)
Environmental, Safety and Health (ES&H) aspects
and Quality Assessment (QA planning: Add text here. (Simone, Wei, Mathieu)
Construction and assembly planning: Add text here. (Simone, Satoshi, Wei, Tonko)
Collaborators and their role, resources and workforce: Add text here. (Satoshi, Zhangbu)
Risks and mitigation strategy: Add text here. (Satoshi, Zhangbu)
Additional Material Add text here.
<<<<<<<<<<<<<<<<<<<<<<<<<<<<<<<
Comments from Silvia:
Dear John and Silvia:
The TOF group is discussing how to work on the TDR document.
We were assigned in the PID section (8.3.4.1).
We have a few questions on how to proceed:
Roughly how many pages should we write?
As it was advertised, the TDR text should be coincise, therefore each
subsystem
is expected to use 10-15 pages. Probably, you have more information
that you would like to
convey. You can us the "addition material" section. Later, this
additional material will be organized
in Appendices. Therefore, the additional material can overcome the
limitation in
number of pages which is imposed for the TDR text.
We will have separate document where our DSC group can write together,
And then we copy over to the master TDR, is this the procedure we should follow?
The procedure is up to you. Several subsystems are collecting material in
their own files and plan to have it transferred to the official overleaf
version
before the dead-lines. The first dead-line is for Version0 on September 29.
For electronics and readout, how much should we write in our section and
How much would be written in the electronics and DAQ sections?
The FEE should be discussed in your section, while the whole read-out chain
is presented in the dedicated section by the electr/r-o/DAQ CC WG conveners.
ES&H: is there a global ES&H, or do we have to write down ourselves?
You have to write down those aspects which are specific to your subsystem.
Best greetings, Silvia
Thanks!
Satoshi and Zhangbu
