EIC HRPPD "2026 design" meeting #4

→ US/Eastern
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zoom: https://bnl.zoomgov.com/j/1619779791?pwd=TUtVak9TMjdsb05CbkVrZmh2a2JzZz09

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I think the ceramic design is nearing completion, the outstanding items are:
  • Incorporating design decisions into the actual design file
  • Tolerance of the air side interposer pads to determine if the 1mm interposer can be used
  • Need to check if sidewalls/MCPs can accommodate a 10mm chamfer per Alex's previous proposal
    • I revisited the previous meeting recording to clear up the confusion from the meeting
 
 
Action items:
  • Ray to contact Kyocera about air pad tolerance
    • Reached out 1/6, awaiting feedback
  • Alexey to provide drawing/model with tab locations and attachment points on HRPPD, including tabs for extra exit of exit MCP connections
    • Ray to add pads/vias and indent vacuum side pads once located
  • Alexey to provide 3D model with MCPs to determine if 10mm chamfer can be used
 
 
Meeting minutes:
  • Discussed air side pad simulations. Maximum air pad size is 1.2mm. With a ground pour with 8mil clearance, there is not significant performance difference from previously discussed best test cases.
  • Gerard suggested it may be easier to assemble the pogo pins onto the backplanes inhouse with a fixture, rather than relying on communicating those instructions to an assembly house
  • Discussed alignment tolerance of ceramic-interposer-PCB stack. Determined we will probably be OK if the dimension below is <0.6mm (half air pad width). 
    • Mark noted in the current design he can misalign stack enough that no contact is made between the ceramic and interposer.
    • Incom has an alignment jig to align stackup. 
  • Alexey reviewed the tab placement of the update HV sidewall design. 
There are minutes attached to this event. Show them.