Beam Test at Jlab and DESY and Japan updates? Room: https://bnl.zoomgov.com/j/1617546118?pwd=qNzxLqF8Q4Mj3RerAZdVSELzEgEQzV.1 Feb 19-25 at KEK, first week of March JLab testbeam results: https://drive.google.com/file/d/1O-Y1ByGy6GPxHMMKGyODMDPGZAW5nWI4/view

feedback and action items from collaboration meeting discussions Room: https://bnl.zoomgov.com/j/1617546118?pwd=qNzxLqF8Q4Mj3RerAZdVSELzEgEQzV.1 FCFD needs LV 2.5V which is not in the current powerboard

scheduled discussions on action item tracker and Al-LGAD Working group (February 12,19) Room: https://bnl.zoomgov.com/j/1617546118?pwd=qNzxLqF8Q4Mj3RerAZdVSELzEgEQzV.1 Dear TOF consortium , We should meet to discuss about the progress on TOF action tracker https://www.dropbox.com/scl/fi/y3jj66yax7c05rtf2g258/TOF_Schedule_activities_v1.xlsx?rlkey=7532tcaf8f1z69h4wp37nbtfq&st=j133n88y&dl=0 I am planning to call for meeting on Wednesday of February 11, 2026 @ 10:30 AM (EST) which was usually the time for TOF general meeting. Unfortunately, there has not been any entry in the progress section of the action tracker. We need to touch base on progress on the following action items BTOF : Procure in kind actual size strip sensor Finalize transmission line pitch of FPC Sample production of FPC Correct glue identification and test Glue curing instrumentation and test Design and test version 1 gluing jigs Following items on BTOF needs more coordination from Purdue so @Jung, Andreas and @Mazza Simone please get in touch with each other soon and plan how to progress along with the timelines for the same (hopefully this can be done before April PDR for TOF) Assemble stavelet mockup with Si heaters and cooling pipe Test mockup for thermal stress FTOF : ASIC and sensor heaters construction Assemble second module based on module V1 with heaters Thermal testing on module v2 @Benoit, Mathieu all the listed activities has start date of on or after 10/30/2025. I suppose activities before that dates are finished so please update the action tracker with the appropriate "Status" Pixel Sensors : Population of "etched" assembly for IJCLab testing Testing (TCT and Sr-90) of etched assembly I will send out the zoom invite soon. Best regards, Surabhi

updates on the stave and stavelet design

• Simone Mazza (University of California - Santa Cruz)
• Simone Michele Mazza

Room: https://bnl.zoomgov.com/j/1617546118?pwd=qNzxLqF8Q4Mj3RerAZdVSELzEgEQzV.1 FCFD1.2 TSMC production received in July 2026. 100 chips, new design of the FCFD final layout with interposer concentrator chips to connect multiple ASICs to reduce FPC lines.