Quick recap
The meeting focused on design challenges and requirements for the TOF (Time of Flight) detector system, particularly regarding DC-DC converter placement and electrical layout decisions. Key discussions centered around whether to integrate converters at the ends of staves or along the stave length, with concerns about voltage stability requirements (plus/minus 5%) and potential magnetic field sensitivity issues. The team identified a gap between mechanical design presentations and electrical requirements that needs to be addressed before the upcoming review scheduled for June 3-4. Updates were also shared on new dedicated EPIC rooms, thermal testing of heater strips, and the development of loading jigs for component assembly, with Simone Mazza noting progress on gluing tests and the need for deeper slots in the jigs to accommodate components properly.
Next steps
- Miles: Perform the power/temperature test on the module inside a box to assess temperature increase with confined air volume.
- Satoshi: Prepare and consolidate a document containing all requirements (mechanical, electrical, hybrid, etc.) for the stave, service hybrid, and related electronics, and share it with the team.
- Zhangbu: Contact Wei (and possibly Tonko) to coordinate participation in the afternoon/evening meeting to discuss integration and layout issues.
- Sushrut: Share the latest module CAD model with the team (Rahul and others) this week for cross-checks on integration, cable routing, and fit with other components.
- Mathieu: Include labeled diagrams in the review talk that clearly identify the different elements in the module stack for clarity to the review committee.
- Simone Mazza: Review the new version of the stave/stavelet, measure relevant dimensions, and send the updated drawing to Grigory for jig design.
- Grigory: Update jig designs based on feedback from Simone Mazza (including slot depth and alignment features) and proceed with testing/iteration.
- Simone Mazza: Test the 3D-printed jigs with dummy components and provide detailed feedback to Grigory for further jig development.
- Simone Mazza: Investigate the feasibility of using adhesive films (as suggested by Sergey) for module/stavelet attachment, including assessment of temperature requirements and long-term stability.
- All relevant team members: Attend and participate in the follow-up meeting(s) (including this afternoon/evening and possibly weekly meetings) to resolve open layout, integration, and requirements questions in preparation for the upcoming review.
- Zhangbu: Ensure clear minutes are taken and distributed from the afternoon/evening meeting, especially regarding integration and layout decisions.
- Andy: Prepare mechanical design options (including local power regulation on stave/module) for review, and be ready to present these as the baseline or with alternatives, clearly highlighting known issues for the review.
- Satoshi (and relevant electronics team): Provide a preliminary CAD/layout of stave, service hybrid, and DC-DC converter placement, including sizes and space envelopes, for mechanical integration checks by Andy and Sushrut.
- Grigory: Consult with Fermilab contacts regarding experience with conductive UV glue and report findings to Simone Mazza.
Summary
EPIC Project Testing Updates
The team discussed updates on their EPIC project, including the establishment of a new dedicated room with a clean bench and dry cabinets for assembly work. Simone Mazza presented test results from Miles showing how power affects module temperature, revealing that at half a watt power, the temperature reaches approximately 34°C within a minute without active cooling. The team agreed to continue testing with higher power loads and to conduct additional tests by enclosing the device in a box to measure temperature changes in a confined environment.
DC-DC Converter Integration Discussion
The team discussed the integration of DC-DC converters into the TOF volume, with Sushrut clarifying that while the converters currently extend outside the designated volume, they can be rerouted radially inward to stay within the Z envelope. Elke raised concerns about the electrical integrity and potential magnetic field sensitivity of the converters, particularly in the high-field region. The team acknowledged the need to better coordinate between mechanical and electrical design considerations, with Zhangbu agreeing to discuss the handling of these issues with Wei.
Sensor Power Distribution Design Challenges
The team discussed design challenges related to power distribution and support structures for sensors and electronics. Satoshi highlighted the need to finalize the layout of the FCFD and determine how to distribute power, including voltage stability requirements of plus-minus 5%. Elke emphasized the importance of having a clear layout to design appropriate support structures, suggesting the creation of a cat model of the stave to simulate voltage loss and ensure requirements are met. Simone Mazza suggested incorporating electronics into modules and proposed involving Wei and Tonko in future discussions. The team agreed to compile requirements into a document and explore design options, with Satoshi committing to prepare a document outlining the necessary information.
Design Review Preparation Discussion
The team discussed concerns about the upcoming review scheduled for June 3-4, particularly regarding the mechanical and electrical design decisions needed before the review. Andy agreed to take responsibility for the mechanical design talk and proposed selecting the safest option from an electrical perspective, though this would require moving the open hole discussion to the electronics talk. The group identified a gap between mechanical and electrical discussions in the review agenda and agreed that someone needs to take ownership of driving the design process forward systematically, with Elke emphasizing the urgency due to the tight timeline before the review.
Forward TOF System Design Discussion
The team discussed the design of the Forward TOF (Time Of Flight) system, including the DC-DC converter on power boards and the support structure for modules. Andy explained the baseline design, which includes cooling loops, foam core, and face sheets built in wedges. John requested that the cutaway diagram be clearly labeled to avoid confusion during reviews. Elke suggested meeting weekly to make decisions and move forward, and mentioned that the team should identify any showstoppers by the evening meeting.
Converter Module Integration Discussion
The team discussed converter modules and their integration into the system. Simone Mazza mentioned needing to investigate module compatibility and power requirements, while Elke suggested creating a layout diagram to show how the components occupy space and fit within the envelope.
TOF Component Loading Jig Prototype
Grigory presented updates on jig designs, addressing concerns about slot depths for component placement, with Simone Mazza noting that slots should be approximately 200 microns deep for gluing purposes. The team agreed that Simone Mazza would provide Grigory with measurements or drawings for the jig design, particularly regarding the middle frame with holes.Grigory presented a prototype of loading jigs designed to place TOF components, including HXN sensors, onto staves with interposers. He explained the precision requirements based on sensor overlap and discussed alternative, more expensive options like gantries. The team is currently waiting for funding transfer and has shipped 3D-printed iterations to Simone Mazza for testing, with plans to switch to machined jigs once the proper loading procedure is fully understood.
The team discussed assembly methods, with Simone Mazza exploring both UV glue and B-component glue options, noting that conductive B-component glue might be preferable to UV glue for better conductivity. Benedikt asked about preventing movement of sandwiched components, which Grigory explained would be addressed through aligning pins with a 150 micron spin requirement. The discussion concluded with Andy suggesting that adhesive films could be an alternative option, though concerns remain about their long-term stability and reworkability.
Films Technical Discussion
The team discussed the advantages and considerations of using films, including their stability and reworkability. They debated the use of potting or encapsulation and the need for a cover plate to protect wire bonds. Rolf requested that a baseline layout concept be prepared for the next meeting. The group acknowledged the need to make decisions on these technical aspects and agreed to have a dedicated discussion on the DC-DC converter later.
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