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BTOF demonstrator/mechanics meeting
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US/Pacific
Description
https://ucsc.zoom.us/j/98299273347?pwd=HHm9tGM6hD7aZaIVWWaF16ueAT3gVu.1
Quick recap
The meeting focused on updates and discussions regarding the development of the stavelet demonstrator for the TOF (Time Of Flight) detector project. Simone Mazza reported completing the loading jig with heat insert and suction cups, which can successfully pick up plastic objects and sensor/ASIC mock-ups. The team discussed routing traces for ASIC connections, deciding to go around the sensor rather than under it to avoid signal interference with sensitive pre-amplifiers. There was extensive discussion about thermal and material budgets, with concerns raised about the current 5-6% radiation length being too high. The team agreed on the need for proper documentation of the stavelet assembly procedure and testing methods, with approximately 15 test stations needed for comprehensive channel testing. The group decided to maintain weekly meetings for now to ensure progress momentum in preparation for the upcoming TDR review.
Next steps
- Grigory: Contact Sergey (and possibly Artur) to obtain the updated dimensions of the FCFD chips for the loading jig design.
- Grigory: Update the loading jig drawing based on the new component locations and discuss with the machine shop for fabrication.
- Simone Mazza: Start drafting the silicon module (stavelet) assembly procedure, including step-by-step instructions for assembly and testing.
- Andy: Engage Matthew (from Purdue) to get involved in module assembly discussions and ensure his participation in future meetings.
- Simone Mazza: Aim to complete the current stavelet assembly before August and send half of it to Andy for thermal studies.
- Simone Mazza: Plan for a full-length stave assembly for CD-3 next year, with final loading to be done at Purdue or Brookhaven.
- Simone Mazza: Estimate the number of testing stations (service hybrids) needed for stavelet testing (approximately 15) and communicate this to Tonko for planning.
Summary
Loading Jig Demonstrator Update
Simone Mazza provided an update on the loading jig for a demonstrator, which was completed with heat insert and suction cups capable of picking up plastic objects and sensor components. The next steps include component placement on an interposer board, assembly on a carbon fiber stave, and thermal testing using a water cooler setup. Grigory inquired about obtaining chip dimensions from Sergey for the FCFD design to assist with the loading jig's vacuum suction cup and placement design.
Chip Design and Dimensions Discussion
Sergey discussed the dimensions of the chip design, providing a ballpark estimate of 15 millimeters by 2.5 mm, though final dimensions may change pending further study on chip placement. The team discussed the need to design a new stavelet with considerations for I2C communication, clock distribution, and readout signals. Tonko clarified that there will be one clock per set of four ASICs rather than individual clocks for each ASIC, and decided to delay the consideration of combining eight ASICs into a single readout channel.
Tablet Prototype Design Discussion
The team discussed the current design scheme for a stavelet prototype, with Sergey confirming they are aligned on the baseline understanding and Simone Mazza clarifying the need for space at the edge of the tablet to route traces between chips. Tonko expressed concerns about the current design drawing and questioned the need to cross the sensor, while Sergey explained the benefits of grouping four ASICs together for testing and manufacturing purposes. The group debated whether to run traces under the sensor with additional copper layers or route them around the sides, with Simone Mazza indicating that the side routing approach would introduce more material budget but was acceptable.
FPC System Structure Discussion
The team discussed the structure and connection details of the FPC system, where Simone Mazza explained that stavelets connect to the FPC through water bonding at specific points, with a monolithic FPC structure measuring 1.3-1.4 meters in length. Rachid emphasized the need for precise marker placement with 5-10 micron accuracy and sensor positioning within 100-150 microns to ensure proper overlap between modules. The discussion concluded with Rachid highlighting concerns about thermal and material budgets, particularly the high 5-6% radiation rate, and proposed conducting FEA analysis at Brookhaven to optimize material thickness and address thermal propagation issues.
Module Assembly Progress Update
The team discussed progress on module assembly and next steps for their project. Simone Mazza and Grigory agreed to complete the assembly before August, with plans to conduct thermal studies and potentially have a full stave assembly ready for next year's CD3 project. Grigory will update the loading jig design based on specific dimensions needed for the assembly, and Rachid suggested starting to document the silicon module assembly procedure as a step-by-step guide to be reviewed and improved later.
Silicon Module Testing Procedures
The team discussed testing procedures for silicon modules, specifically focusing on how to connect and test tablet/stablet modules. Simone Mazza explained the need for a temporary service board with either wire bonding or clamp connectors, while Tonko and Rachid raised concerns about the resource requirements and maintenance of probe card solutions versus wire bonding methods. The group agreed to create documentation for module assembly and testing procedures, with Rachid suggesting one lead person should be assigned to oversee the process. The team decided to continue meeting weekly for now to maintain progress momentum ahead of the TDR review, though they acknowledged this frequency might change after the review.
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