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BTOF demonstrator/mechanics meeting
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US/Pacific
Description
https://ucsc.zoom.us/j/98299273347?pwd=HHm9tGM6hD7aZaIVWWaF16ueAT3gVu.1
Quick recap
The meeting focused on discussing design challenges with the service hybrid region, specifically addressing space constraints and connector requirements. Wei and Andy discussed the current 65mm envelope and a proposed 60mm service hybrid design that presents height issues, with Wei explaining that the design requires sophisticated connections between the power board, readout board, and FPC (Flat Plate Connector) that extend across the full 60mm dimension. The team identified that they are "paralyzed" by uncertainty about the required connector specifications, particularly the expected length and width of the FPC connector, which needs to be determined by Takashi's team before any further design optimization can proceed. They discussed potential solutions including a three-layer design with slightly different sensor orientation that maintains around 80% coverage, though this would require additional thermal performance analysis and material considerations. The team agreed that the main constraint is height rather than other dimensions, and that achieving 95% detector coverage would be realistic rather than aiming for 100% perfect coverage.
Next steps
- Wei: Push to get information/specification on the connector (FPC connector) from Takashi and report back to the group.
- Andy: Work on reducing the mechanical height (e.g., thinning substrate, removing core) to fit within the envelope and assess thermal performance.
- Wei: Evaluate the physics impact of the 80% coverage two-layer design and report findings.
- Andy: Re-evaluate the service hybrid region design to optimize space and height.
- All: Update and discuss progress in the weekly meeting next week.
Summary
Two-Layer System Design Constraints
Andy and Simone Mazza discussed design constraints related to the thickness and layout of components in a two-layer system, particularly focusing on the service hybrid region and its interaction with other elements like the power board and readout board. Simone Mazza explained the current stack dimensions, including the height of the coil, radar board, and required spacing, while highlighting the complexity of connecting the FPC, readout board, and power board due to the need for sophisticated connectors. They explored options to optimize the design, including potentially separating components or adjusting the layout, but concluded that more details about the service hybrid's structure and connection requirements are needed to determine viable solutions.
Connector Specifications Discussion
The team discussed connector requirements between the readout board and FPC, with Wei explaining that two connectors would be needed and the total length would be 60 millimeters. Tonko emphasized that they are currently paralyzed by the lack of knowledge about the required connector specifications, which needs to come from the FPC team. The team agreed that before they can make real design decisions or consider alternative layouts like a mezzanine level, they need initial specifications for the connector, including its length, width, and height.
Sensor System Design Configuration Options
The team discussed design options for a sensor system, focusing on two-layer versus three-layer configurations. Andy explained that while the three-layer design would maintain similar total sensor count (around 240-242 staves), it would offer 80% coverage and require different spatial orientation. Wei emphasized the need to select a connector type and complete the design optimization, noting that multiple requirements including voltage delivery and power board constraints need to be considered. The team acknowledged that further design work is needed to determine if the three-layer approach is feasible given the space constraints.
Two-Layer System Design Constraints
The team discussed design constraints for a two-layer system with 80% coverage, where Andy confirmed that significant rearrangement would only improve coverage by about 1%, constrained by physical limitations including tray arrangements and space requirements. Simone Mazza agreed to investigate connector information and explore ways to reduce the height while maintaining functionality, particularly focusing on the 6mm substrate thickness issue that exceeds the 65mm envelope. The team acknowledged that achieving 100% coverage might not be realistic, with 95% being more practical, and agreed to reassess the impact of the proposed 20% coverage reduction on physics performance before making any design changes.
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