Hi all,

Here is the meeting minutes. Mainly action items are listed.

- Silver epoxy glue mask and flow measurement criteria for the stave
(Rachid)

 o Genki should calculate the volume of the bonding mask and calculate
the effective thickness of the silver epoxy glue and finish up his GEANT
model update. To be reported in the tracking group meeting if required.

 o Itaru reflects Rob's newly proposed criteria as the testing item of
the production stave in the specification document.

- Sensor QA (Kai-Yu)

 o Although the cause of the double band is not understood, he continues
silicon QA with newly invented method-2 which doesn't show double band.

- Ladder testing (Cheng-Wei)

 o Bias on/off slope difference in the calibration invented by Cheng-Wei
works to identify the missing wire bonding channel. We also look into
direct noise measurement in the test bench which will also tell the
missing wire bonding, plus this measurement is necessary to evaluate the
ladder performance anyway to record the fake hit rates for all ladders.

- Production status and the ladder testing procedure (Itaru)

 o We agreed to send one of early assembled ladder in Taiwan and BNL to
NWU and tested there.

 o Itaru will investigate the BNL exporting regulation of the ladder.

 o Itaru will arrange with Rachid to send another bag of FPHX chip to NCU.

 o Rachid will find out the humidity control of the lab and storage in BNL.

 o Itaru will check the required humidity/temperature storage conditions
of silicons from the manual, otherwise ask HPK.

 o The noise measurement in test bench will be attempted at NWU.

 o Wei looks into the feasibility to omit the source test to save time
of the redundancy of cosmic ray.

-> Conclusion is the rate is too small to use cosmic ray to identify the
dead channel in silicon sensor. We will pursue setup for the source test.

 Let me know if there is any action item I've overlooked.

The next meeting is the next week.

Regards,

-itaru