INTT Weekly meeting
Tuesday 21 July 2020 -
20:55
Monday 20 July 2020
Tuesday 21 July 2020
21:10
Updates on the glue thickness for Geant4 model
-
Genki NUKAZUKA
(
RIKEN BNL Research Center
)
Updates on the glue thickness for Geant4 model
Genki NUKAZUKA
(
RIKEN BNL Research Center
)
21:10 - 21:20
Using information from Rachid last week, the thickness of the silver epoxy glue for FPHX chips and silicon sensors is updated and reported.
21:20
the status of INTT assembly in Taiwan
-
Cheng Wei Shih
the status of INTT assembly in Taiwan
Cheng Wei Shih
21:20 - 21:40
21:40
Sensor QA in NCU
-
Kai-Yu Cheng
Sensor QA in NCU
Kai-Yu Cheng
21:40 - 22:00
22:00
Production Status
-
Itaru Nakagawa
(
RIKEN
)
Production Status
Itaru Nakagawa
(
RIKEN
)
22:00 - 22:20
22:20
Online Monitoring
-
Milan Stojanovic
(
Purdue University
)
Online Monitoring
Milan Stojanovic
(
Purdue University
)
22:20 - 22:40