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ECCE Tracking Working Group Meeting
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US/Mountain
Description
EIC ECCE tracking discussions.
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https://bnl.zoomgov.com/j/1618724619?pwd=MlFFejBUenlrZVhxZlFrMEUwaVFUdz09
US (San Jose)
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Meeting ID: 161 872 4619
Passcode: 212461
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Meeting ID: 161 872 4619
Passcode: 212461
Contact
Meeting minutes:
1) All Silicon Tracker updates with integration of the ToF by Rey (LBNL):
Rey reported the impacts on the tracking performance of the All-Si Tracker with different LGAD based ToF radii. We discussed about the locations of the LGAD based ToF and suggest either replacing the outer layers of the All-Si tracker with LGAD based ToF or place the ToF outside the All-Si tracker.
One suggestion raised during the discussions, which is to search for silicon technology which can carry out the dE/dx measurements for PID purpose.
Another suggestion is to check the consistency within the eRD25 consortium as different tracking performances and material budgets were presented in the China consortium presentation in the May 21 meeting.
2) Gas technology summary by Nilanga (UVA):
Nilanga present several Mature MPGD Technologies: GEM, MPGD, micro-well etc. Discussed about the technology down selections and implementation of the detector geometries in the Fun4All.
We also discussed about preparing a table to summarize the performance with categories including: spatial resolution, material budgets, alternative options, which provide the other capability, cost etc. Nilanga and Xuan will start the straw man summary and welcome inputs from the working group.
3) Adding some realism to support structures and services for EIC silicon by Brian (JLab) and Jim (JLab):
Brain and Jim provided the latest engineering drawing and design based the Si+TPC design documented in the EIC YR. The distribution of the silicon detector service parts are based on the ITS-2 design. We discussed options about: changing the service part layout, reducing the service material budgets, where to replace the Silicon layers with MPGD layers, installation and assembly plan.
Asked to provide more details on the service parts from the current technology choices and more details about the disk layout.
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