BIC Modules & Staves Meeting

US/Central
Manoj Jadhav (Argonne National Laboratory)
    • 1
      Introduction

      Updates, News

      Speaker: Manoj Jadhav (Argonne National Laboratory)
    • 2
      Round Table
      • a) Module Design and Assembly at Argonne
        Speaker: Manoj Jadhav (Argonne National Laboratory)
      • b) Overview of the module assembly activity in Korea for the ALICE upgrade
        Speakers: Sanghoon Lim (Pusan National University), Sanghoon Lim
      • c) Module Design and Assembly at UCSC
        Speakers: Anthony Affolder (University of California Santa Cruz), Vitaliy Fadeyev (SCIPP, UCSC)
      • d) Module Bus Bar (AstroLinx) OSU
        Speakers: Blake Beauchamp (member@okstate.edu;staff@okstate.edu), Gregory Michael Shildt, Steven Welch (Oklahoma State University)
    • 3
      Discussion

      The first iteration of the Module prototype will be with v3 chips (18700 X 19575) um2
      Discussion about wire-bonding to Rigid PCB
      Alignment of chips