OB module: ad-hoc meeting

Tuesday 10 Jun 2025, 15:00 → 16:10 Europe/London

Marcello Borri (staff@stfc.ac.uk), James Julian Glover (University of Birmingham (UK))

Please see Marcello's email for Zoom link.

15:00 → 15:15 University of Birmingham

Speakers: Che Sum Tse (University of Birmingham UK), James Julian Glover (University of Birmingham (UK))

25-06-10_DummySilicon_JJG_r1.pdf

15:15 → 15:30 Brunel University

Speaker: Liliana Teodorescu (Brunel University London)

15:30 → 15:45 Daresbury Laboratory

Speakers: Marcello Borri (staff@stfc.ac.uk), Matthew Buckland (staff@stfc.ac.uk), Ken Davies (UKRI STFC Daresbury)

20250521-epicSvtObModuleV0-rep-2021a01.pdf

15:45 → 16:00 University of Liverpool

Speaker: Jian Liu (University of Liverpool)

Foils_bonding_Liverpool_20250610.pdf

Dummy wafer update from the supplier 

• The supplier is following up on our previous discussion regarding the chip order

• They propose moving the order to July or August to enable a faster turnaround

• They note that their production schedule is filling up, so early confirmation would help secure a favorable slot

• The expected lead time remains approximately 2 to 2.5 months

• They ask whether we see the possibility of placing the order within that time frame

16:00 → 16:10 Other remarks

Mtg at Brunel on 26/07

J.Glover to present summary on FPC interconection and wire bonding tests of FPC substrate?

J.Liu to present summry report on wire-boding on FPC substrate and future procrement of dummy components?

M.Borri status on mechanics plus update on module testing?