OB module: ad-hoc meeting
Please see Marcello's email for Zoom link.
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University of Birmingham 15mSpeakers: Che Sum Tse (University of Birmingham UK), James Julian Glover (University of Birmingham (UK))
Removal of 50um thick Si from the GelPaks has been trialled. Si flexes a lot, but does not break.
Trials were done with a handheld vacuum tool and a manual pick and placer (see attached videos). Both only used a single vacuum cup around the centre of the chip's length. Looking to trial a pick-up tool with suction cups towards the end to see whether this minimises the flex in the Si.
JJG is optimistic that the GelPaks could be a viable solution.
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Brunel University 15mSpeaker: Liliana Teodorescu (Brunel University London)
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Daresbury Laboratory 15mSpeakers: Marcello Borri (staff@stfc.ac.uk), Matthew Buckland (staff@stfc.ac.uk), Ken Davies (UKRI STFC Daresbury)
Progressing the design of the jig for early prototyping of OB modules.
The jig was design reviewed on 29/07/2025, clarification and implementation of the final refineements is ongoing. [New request [JJG]: to make sure that a consistent shimming can be applied between AncAsic region and LAS region]
Detailing of drawigns will happen in the sencond half of august with the goal of sending all drawring the Liverpool in early Sept.
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University of Liverpool 15mSpeaker: Jian Liu (University of Liverpool)
- A few more tests with the optimal settings on thinner diffuser (0.068 mm)
- Cleaning improved mean pull force and reduced standard deviation
- Single- and multi-layer foils bonded successfully with nominal tail lengths; longer tails not necessary
- Some technical details to be clarified with Liam
- The softer wire was ordered
- Jian will be on leave from Aug. 13th to Sep. 15th. Stay reachable via emails and Mattermost
- A few more tests with the optimal settings on thinner diffuser (0.068 mm)
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Other remarks 10m
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