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EIC HRPPD "2026 design" meeting #4
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US/Eastern
Description
I think the ceramic design is nearing completion, the outstanding items are:
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Incorporating design decisions into the actual design file
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Tolerance of the air side interposer pads to determine if the 1mm interposer can be used
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Need to check if sidewalls/MCPs can accommodate a 10mm chamfer per Alex's previous proposal
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I revisited the previous meeting recording to clear up the confusion from the meeting
Action items:
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Ray to contact Kyocera about air pad tolerance
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Reached out 1/6, awaiting feedback
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Alexey to provide drawing/model with tab locations and attachment points on HRPPD, including tabs for extra exit of exit MCP connections
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Ray to add pads/vias and indent vacuum side pads once located
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Alexey to provide 3D model with MCPs to determine if 10mm chamfer can be used
Meeting minutes:
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Discussed air side pad simulations. Maximum air pad size is 1.2mm. With a ground pour with 8mil clearance, there is not significant performance difference from previously discussed best test cases.
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Gerard suggested it may be easier to assemble the pogo pins onto the backplanes inhouse with a fixture, rather than relying on communicating those instructions to an assembly house
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Discussed alignment tolerance of ceramic-interposer-PCB stack. Determined we will probably be OK if the dimension below is <0.6mm (half air pad width).
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Mark noted in the current design he can misalign stack enough that no contact is made between the ceramic and interposer.
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Incom has an alignment jig to align stackup.
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Alexey reviewed the tab placement of the update HV sidewall design.
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