***ATTENTION Indico Users***

Notice: LaTeX services are temporarily disabled and will be reintroduced in 3.3.12 which is currently being planned

Please see the News section for more information.

BTOF demonstrator/mechanics meeting

US/Pacific
Description

https://ucsc.zoom.us/j/98299273347?pwd=HHm9tGM6hD7aZaIVWWaF16ueAT3gVu.1

Quick recap

The meeting focused on the design and integration of the power distribution system for the detector, particularly the DC-DC converter and linear regulators. Tonko reported that Norbert Nowitzki's team was developing a new DC-DC converter based on the CERN design but optimized for their needs, which could be cheaper and more suitable. The group discussed the challenge of fitting all necessary components within the tight space constraints, especially for a three-layer stave design, and considered moving the linear regulators closer to the chips on the FPC to improve performance and simplify the power board. Elke raised the need for a comprehensive document outlining all geometry and component constraints to better assess the design options. Andreas noted that even the two-layer design might exceed the allowed thickness, depending on cooling and connector solutions. The team also touched on the status of thermal simulations and the need for better coordination. After the main meeting, Grigory and Simone Mazza discussed funding and hiring issues for technical support, as well as plans for testing strip sensors alongside pixels.

Next steps

  • Tonko: Meet with Norbert Nowitzki and his engineers next week to discuss the new DC-DC converter design and how to proceed.
  • Andreas: Create a document laying out geometry constraints, component sizes, and stack-up for the 2- and 3-stave designs, and share it with the team.
  • Andreas: Coordinate a meeting next week with Takashi, Hancheng, Anish, Satoshi, and others to discuss thermal FEA and support the simulation work.
  • Simone Mazza: Investigate the feasibility of mounting the linear regulator components on a small FPC carrier and integrating it with the FPC design.
  • Takashi: Continue communication and propose a connector solution between the FPC and the service hybrid.
  • Grigory: Explore options to hire the engineer through another department or support structure, and discuss further with Simone Mazza or others if needed.
  • Grigory: Filter out noise waveforms offline in the amplitude analysis to improve signal quality.

Summary

Service Hybrid DC-DC Converter Updates

The team discussed updates on the Service Hybrid project, with Tonko sharing news about Simone Mazza's team developing a DC-DC converter based on the CERN module design. The new converter features a PCB with five times higher inductance and will be customized to ePIC's needs, including modifications to edge connectors. Tonko planned to meet with the development team the following week to discuss further implementation details, as they expected to have an in-house prototype ready within a couple of weeks.

Coil Thickness Reduction Solution Discussion

Wei discussed the need to reduce the thickness of a coil and presented a CERN module as a potential solution, which could reduce the thickness to about 10 millimeters for a three-layer design. However, the linear regulator's size presents a challenge as it measures 60 millimeters, making it difficult to fit within the available space. Simone Mazza questioned the dimensions of the regulator, confirming its size as 6 millimeters by 3 millimeters, but the overall length was still a concern for fitting within the stave.

Component Placement and Voltage Distribution

The team discussed component placement, specifically focusing on linear regulators and voltage distribution. Wei explained that each bipole needs to output four different voltages for two stabilists, requiring linear regulators approximately one square centimeter in size. Simone Mazza considered placing the components on the FPC due to space constraints in the tablet, which would only have about 1.1 centimeters available for components after accommodating the 6x3 millimeter chips.

Stable Component Mounting Design Decision

The team discussed mounting components for a stable, agreeing to use two components per stable rather than one per chip. They decided to create a small FPC carrier board containing the chip and associated passive components (resistors and capacitors) to simplify manufacturing and reduce complexity. The group determined that this approach would make more sense performance-wise and could be manufactured for approximately one dollar per piece, with only one connector in and one connector out.

FPC Component Design Discussion

The team discussed design options for FPC components, with Simone Mazza suggesting it's possible to accommodate surface mount components on the FPC. Elke raised concerns about whether the power board redesign is necessary, questioning if simulations prove a three-stage layout is required before proceeding with the redesign. Andreas explained that even with a two-stage layout, the design exceeds the envelope by 7mm, though removing the core in the service hybrid region could reduce this to 2mm over the envelope. Andreas acknowledged needing to consult with Han Cheng and Anish about potential issues with the 2mm violation and whether the service hybrid can accommodate the reduced footprint.

Component Geometry Documentation Planning

The team discussed component geometry and constraints, with Wei suggesting moving the linear regulator would improve voltage stability and performance. Elke emphasized the need for a comprehensive document showing all component sizes and geometry constraints to avoid overlooking issues. Andreas acknowledged the lack of a consistent mechanical documentation and agreed to create it, starting with describing the two geometries and incorporating input from Wei and Tonko on the service hybrid. The conversation ended with Andreas asking for updates on thermal FEA work from Anish or Hansheng.

Thermal FES Project Coordination Meeting

Anish reported no updates on thermal FES, as he is waiting for physics simulations and CADs from Hancheng to finalize coverage requirements. Andreas suggested scheduling a meeting with Takashi, Hancheng, Anish, Satoshi, and himself to coordinate efforts and support the simulations. Takashi confirmed ongoing communication regarding the connector between the FPC and service hybrid. Simone Mazza inquired about surface mounting possibilities and received confirmation from Takashi, and Grigory raised a question about using PD money for student payments, though the transcript ended before an answer was provided.
There are minutes attached to this event. Show them.
    • 1
      UCSC updates
      Speaker: Simone Michele Mazza
    • 2
      Jigs
      Speakers: Grigory Nigmatkulov (University of Illinois Chicago), Simone Michele Mazza
    • 3
      Thoughts on BTOF stave
      Speaker: Rachid Nouicer (Brookhaven National Laboratory)
    • 4
      long FPC update
      Speaker: Takashi Hachiya (RIKEN)
    • 5
      Service Hybrid
      Speakers: Tonko Ljubicic (Rice University), Tonko Ljubicic (Rice University), Tonko Ljubicic (Rice Uni), Wei Li (Rice University), Prof. Wei Li (Rice University)
    • 6
      FCFD
      Speakers: Artur Apresyan (Fermilab), Artur Apresyan (Fermilab)
    • 7
      Mechanics
      Speakers: Andreas Werner Jung (member@cern.ch), Han-Sheng Li (Purdue University)