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    ESB/DAQ Readout

    → US/Eastern
    Description
    https://uregina-ca.zoom.us/j/98915102548?pwd=6Be10hz7OQ3WLS2NvFGKcenSx5MbF6.1
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    ESB/Systems Testing Meeting

    October 6, 2026

    Attendees: Shefali ., Norbert Novitzky, Akshaya Vijay, Bo Gyeong Seo, Bobae Kim, Dan Cacace, Girish (ggowda1), Halen Davies, Junseop Shin, Maria Żurek, Shinhyung Kim, Wouter Deconinck, Zisis Papandreou

    Agenda

    1. Announcements, Updates, Goals
    2. Manitoba: cooling
    3. Action Items
    4. AOB
    5. Next meeting

     

    Minutes

    1. Announcements, Updates, Goals: 
      1. GTLs working on budgets; new type of meeting started yesterday with Institutional Contract Contacts (ANL, NASA, UCLA, OSU, UofR)
      2. Electronics Consolidation: The planned meeting at NASA with all the engineers together (NASA, ORNL, OSU, Hungary) is now scheduled for November 3-5.
    2. Cooling tests: presentation by Shefali.  Test modules #1-#4 compared.  See Zoom summary below. The key point was that it would be advantageous to have the SiPMs at 7 C and the CALOROC/ETC at 20 C, and potentially locate part of the ESB contents outside the boxes, on the periphery of BIC.
    3. AOB: none
    4. Next meeting: ESB/DAQ: October 20.

     

    Sample cooling materials:

    https://www.digikey.ca/en/products/detail/3m-tc-/8810SQ-19(10)/2649858

    https://www.laird.com/products/thermal-interface-materials/gap-fillers

     

    Zoom Notes Summary

    Key Outcomes

    The team successfully validated a dual cooling strategy using Peltier coolers (TECs) and liquid cooling, achieving SIPM board temperatures below 8°C even with 20°C coolant 12. While effective, this approach significantly increases heat load and power consumption, leading the team to explore decoupling the KaloRock board from the cold plate to reduce the cooling burden 34.

    Technical Findings & Progress

    • Model 1: Showed poor thermal conduction (up to 30.5°C at sensor C4) due to non-planar geometry and air gaps 15.
    • Model 2: Improved heat transfer by drilling cooling channels directly into the aluminum sheet, keeping the PCB under 24.5°C 67.
    • Model 3: Replaced direct aluminum water channels with press-fit copper pipes to prevent long-term corrosion while maintaining similar thermal performance to Model 2 278.
    • Model 4 (Dual Cooling): Combined liquid cooling with six series-connected Peltier coolers, successfully cooling the SIPM board to under 8°C 289.
    • Observation: Condensation was observed during the lowest temperature tests in Model 4 10.

    Decisions & Recommendations

    • Thermal Interface: The team will investigate thermal conductive foams or gap pads (suggested thickness of 3-4mm) to handle two-sided PCBs and avoid grounding components to the aluminum plate 111213.
    • Design Optimization: The KaloRock board should be decoupled from the 7°C cold plate and placed on the 20°C side to reduce the power required for the TECs and minimize the overall heat load 414.
    • Integration: Potential placement of manifolding or other components on the backward side of the BIC is to be explored 15.

    Risks & Open Questions

    • Power Load: TECs are inefficient, potentially increasing the heat load from 1kW to approximately 10kW, which may require larger negative pressure units for water circulation 316.
    • Radiation Hardness: The radiation resistance of the Peltier coolers is unknown; they need to be included in future irradiation campaigns 1718.
    • CFD Validation: Lab results for the TECs still need to be validated via computational fluid dynamics simulations 2.

    Action Items

    • Norbert: Measure component heights on the board and email the team to confirm required foam thickness 13.
    • Dan: Send links to recommended thermal pad/gap pad materials 19.
    • Team: Prepare draft slides for the DAC Review by the beginning of next week (deadline for calorimetry is October 16) 2021.
    • Zisis/Dan: Bring up BIC integration and perimeter placement issues at the Monday engineering meeting 15.

     

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