ePIC SVT WP3 Electrical Interfaces Meeting

Thursday 13 Mar 2025, 10:00 → 11:35 US/Eastern

10:00 → 10:30 Al FPC Development by FBK¶

Speaker: David Novel (FBK)

David Novel@FBK, wafer-level (6 inch, 15 cm) 10-20 um Caption (25um poly-amide standard) + 10-20 um Al (20 standard, 40+40 um width+gap, can try thinner Al), 75x75 um2 spTAB: Length limit: stitching; R/O Speed: eye diagram + Z0/Z0_diff; SMD integration: plating planned; Small productions.

ToDo: Slides to be uploaded by the speaker.

10:30 → 10:50 Update on Interconnection for OB prototyping¶

Speaker: James Julian Glover (University of Birmingham (UK))

25-03-13_SVT-OB_Module_Bonding_JJG_r1.pdf

James: damages during handling; Ihor will follow up with James, use encapsulation to protect sPTAB bonding, LTU checked the bindability before shipping out.

10:50 → 10:55 Introduction¶

Speakers: Marcello Borri (staff@stfc.ac.uk), Zhenyu Ye (Laurance Berkeley National Laboratory)

10:55 → 11:05 Update on Disk related activity¶

Speakers: Xuan Li (Los Alamos National Laboratory), Zhenyu Ye (Lawrence Berkeley National Laboratory)

11:05 → 11:15 Update on OB related activity¶

Speakers: Andrew Hill (staff@stfc.ac.uk), Joellen Renck (Los Alamos National Laboratory), Marcello Borri (staff@stfc.ac.uk), Todd Huffman (member@ox.ac.uk;staff@ox.ac.uk), William Helsby (staff@stfc.ac.uk)

20250226-bFpcProbeTestProposal-rep-2021a10.pdf

Andrew: bFPC test jig to allow testing bFPC-sensor assembly before mounting to mFPC

11:15 → 11:25 Update on IB related activity¶

Speakers: Andrew Hill (staff@stfc.ac.uk), Laura Gonella (INFN Trieste)

Andrew: 6 mock-ups for mechanical characterization, made with Cu, 3 flexes. Plate-through-holes (CERN) vs tabBonding (LTU).

Laura: Trieste will receive ITS3 FPC prototypes from CERN and will do FPC characterization,

11:25 → 11:35 Further brainstorming¶