OB module: ad-hoc meeting

Monday 6 Jan 2025, 14:00 → 15:20 Europe/London

Marcello Borri (staff@stfc.ac.uk), James Julian Glover (University of Birmingham (UK))

Please see Marcello's email (subject: "EPIC SVT: OB module: ad-hoc meeting") for Zoom link.

1 University of Birmingham¶

Speakers: Che Sum Tse (University of Birmingham UK), James Julian Glover (University of Birmingham (UK))

24-01-06_SVT-OB_Module_Bonding_JJG_r2.pdf

2 Daresbury Laboratory¶

Speakers: Marcello Borri (staff@stfc.ac.uk), Matthew Buckland (staff@stfc.ac.uk)

20250106-epicSvtObModuleAssemblyFlowAndModuleOptions-2021a01.pdf

20250106-epicSvtObModuleV0-rep-2021a01.pdf

Summary of discussion:

Metallisation on dummy LAS and AncAsic would be preferable.

Dummy AncAsic made of glass substrate with metallization should achievable: 300um thickness. But is the form factor of 15mmx1.5mm going to be an issue for dicing?

Dummy LAS: is it possible to get it made of glass ~50um thick?
(EPIC will procure dummy Si wafers with metallization, mainly for MOSAIX, any portions of this wafers that could be used for our OB module prototyping?)

3 University of Liverpool¶

Speaker: Jian Liu (University of Liverpool)

OB_Module_electrical_test.pdf

4 Other remarks¶

Speakers: James Julian Glover (University of Birmingham (UK)), Marcello Borri (staff@stfc.ac.uk)

20241204-epicSvtObModuleV3-rep-2021a01.pdf

To send to Liverpool: 1 spTAB wedge + 1 set of spTAB test structure to practice spTAB bonding (pull test measurements).