OB module: ad-hoc meeting

Monday 3 Feb 2025, 14:00 → 15:30 Europe/London

James Julian Glover (University of Birmingham (UK)), Marcello Borri (staff@stfc.ac.uk)

Please see Marcello's email for Zoom link.

14:00 → 14:15 University of Birmingham

Speakers: Che Sum Tse (University of Birmingham UK), James Julian Glover (University of Birmingham (UK))

25-02-03_SVT-OB_Module_Bonding_JJG_ET_r2.pdf

14:15 → 14:30 Brunel University

Speaker: Liliana Teodorescu (Brunel University London)

14:30 → 14:45 Daresbury Laboratory

Speakers: Marcello Borri (staff@stfc.ac.uk), Matthew Buckland (staff@stfc.ac.uk)

20250106-epicObModuleOptionsV0-rep-2021a01.pdf

20250203-epicSvtObModuleAssemblyV0-rep-2021a01.pdf

20250203-epicSvtObModuleOptionsV1-rep-2021a01.pdf

20250203-epicSvtObModuleOptionsV1-rep-2021a01.pptx

14:45 → 15:00 University of Liverpool

Speaker: Jian Liu (University of Liverpool)

Jian Liu:

• NSJP: seems to be available
  • They will source the 50 um wafer and then, bond the wafer to a carrier to facilitate processing -> metalization -> debonding -> dicing -> packaging 
    • They do not have chip trays for the specified chip size and can ship the chips on a dicing ring for manual separation at our end. Is it acceptable?
    • In view of the thickness (50um), deposition will be done using evaporation or sputtering and not electroplating. In that case, Al can be around 500 nm, and for Cu, it will be around 1 µm. Will this work for us? 
    • For AncASIC, dicing a chip size of 15 mm x 1.5 mm is challenging, but they are willing to try. They need to do a dicing test at the start before fabricating the actual sample. Increasing from 1.5 mm to 3 mm would have a better yield. But I think we should stick to 1.5 mm. Correct me if I am wrong
    • Delivery time is 1 to 2 months (initial testing time included)
    • A quotation will be given as soon as above points are clarified
• PKM: possibly also available. A short meeting scheduled on Wednesday 
• Other suppliers (including SVM) do not fit our requirement well

 

To discuss transport tray for prototypes: custom made? 3D print them in house?

15:00 → 15:10 Other remarks

Speakers: James Julian Glover (University of Birmingham (UK)), Marcello Borri (staff@stfc.ac.uk)

20250203-epicSvtObModuleComponentsdSizeV0ForPrototyping-rep-2021a01.pdf