BIC Modules & Staves Meeting

US/Central
Manoj Jadhav (Argonne National Laboratory)
    • 16:30 16:35
      Introduction 5m

      Updates, News

      Speaker: Manoj Jadhav (Argonne National Laboratory)
    • 16:40 17:25
      Round Table 45m
      • Module Design and Assembly at Argonne 10m
        Speaker: Manoj Jadhav (Argonne National Laboratory)
      • Overview of the module assembly activity in Korea for the ALICE upgrade 15m
        Speakers: Sanghoon Lim (Pusan National University), Sanghoon Lim
      • Module Design and Assembly at UCSC 10m
        Speakers: Anthony Affolder (University of California Santa Cruz), Vitaliy Fadeyev (SCIPP, UCSC)
      • Module Bus Bar (AstroLinx) OSU 10m
        Speakers: Blake Beauchamp (member@okstate.edu;staff@okstate.edu), Gregory Michael Shildt, Steven Welch (Oklahoma State University)
    • 17:20 17:30
      Discussion 10m

      The first iteration of the Module prototype will be with v3 chips (18700 X 19575) um2
      Discussion about wire-bonding to Rigid PCB
      Alignment of chips