OB module: ad-hoc meeting

Monday 13 Oct 2025, 14:00 → 15:30 Europe/London

Marcello Borri (staff@stfc.ac.uk), James Julian Glover (University of Birmingham (UK))

Please see Marcello's email for Zoom link.

14:00 → 14:15 University of Birmingham

Speakers: Che Sum Tse (University of Birmingham UK), James Julian Glover (University of Birmingham (UK))

See James' presentation from the last SVT WP3 (Electrical Interfaces) meeting for an update on the M-FPC bonding. This sample has been sent to Daresbury Lab for testing and is awaiting a visual inspection report post-shipment.

14:15 → 14:30 Brunel University

Speaker: Liliana Teodorescu (Brunel University London)

14:30 → 14:45 Daresbury Laboratory

Speakers: Marcello Borri (staff@stfc.ac.uk), Matthew Buckland (staff@stfc.ac.uk), Ken Davies (UKRI STFC Daresbury)

20251020-epicSvtModuleUpdateKDavies-rep-2021a10.pdf

318-10087-revA.pdf

318-10101-revA.pdf

-The drawings for the increment 1 jigs are complete and they have been send to Lpool. Next: to work on the remianing tools and jigs for module assembly.

-The procurement of dummyAncAsic and dummyLAS would be beneficial to progress prototyping. [Latest estimate on the size of AncAsic is 15mm * 2.5mm]

-To clarify if EIC-SVT is buying mechanical babyMOSAIX with metallization as part of the ER2 order of EIC wafers. [20251014 J.Liu: yes, Just confirmed with Magnus that there will be also babyMOSAIX available on the ER2 pad wafers]

14:45 → 15:00 University of Liverpool

Speaker: Jian Liu (University of Liverpool)

• WIre-bonding tests
  • Comparative test with cleaning using acetone on thinner diffuser (0.068 mm) - ongoing
  • Softer wire received in Liverpool. A few tests when one of the wire bonders is free - todo
• Jigs
  • Drawings and stp files received. Discussion with Liverpool workshop - ongoing

15:00 → 15:10 Other remarks