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OB module: ad-hoc meeting

→ Europe/London
James Julian Glover (University of Birmingham (UK)), Marcello Borri (staff@stfc.ac.uk)
Description

Please see Marcello's email (subject: "EPIC SVT: OB module: ad-hoc meeting") for Zoom link.

    • 14:00 → 14:20
      University of Birmingham 20m
      Speakers: Che Sum Tse (University of Birmingham UK), James Julian Glover (University of Birmingham (UK))
      24-01-06_SVT-OB_Module_Bonding_JJG_r2.pdf
    • 14:20 → 14:40
      Daresbury Laboratory 20m
      Speakers: Marcello Borri (staff@stfc.ac.uk), Matthew Buckland (staff@stfc.ac.uk)
      20250106-epicSvtObModuleAssemblyFlowAndModuleOptions-2021a01.pdf
      20250106-epicSvtObModuleV0-rep-2021a01.pdf

      Summary of discussion:

      Metallisation on dummy LAS and AncAsic would be preferable.

      Dummy AncAsic made of glass substrate with metallization should achievable: 300um thickness. But is the form factor of 15mmx1.5mm going to be an issue for dicing?

      Dummy LAS: is it possible to get it made of glass ~50um thick?
      (EPIC will procure dummy Si wafers with metallization, mainly for MOSAIX, any portions of this wafers that could be used for our OB module prototyping?)

    • 14:40 → 15:00
      University of Liverpool 20m
      Speaker: Jian Liu (University of Liverpool)
      OB_Module_electrical_test.pdf
    • 15:00 → 15:20
      Other remarks 20m
      Speakers: James Julian Glover (University of Birmingham (UK)), Marcello Borri (staff@stfc.ac.uk)
      20241204-epicSvtObModuleV3-rep-2021a01.pdf

      To send to Liverpool: 1 spTAB wedge + 1 set of spTAB test structure to practice spTAB bonding (pull test measurements).

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